Electronic component

ABSTRACT

An electronic component includes an element body and an external electrode. The element body includes a side surface and an end surface. The external electrode includes a conductive resin layer disposed over the side surface and the end surface. The conductive resin layer includes a first region positioned on the end surface, a second region positioned on the side surface, and a third region positioned on a ridge portion between the end surface and the side surface. In a case where a maximum thickness of the first region is T1 (μm), a maximum thickness of the second region is T2 (μm), and a minimum thickness of the third region is T3 (μm), the maximum thickness T1 and the maximum thickness T2 satisfy a relation of 
         T 2/ T 1≥0.11,
 
     and the maximum thickness T1 and the minimum thickness T3 satisfy a relation of 
         T 3/ T 1≥0.11.

BACKGROUND OF THE INVENTION 1. Field of the Invention

The present invention relates to an electronic component.

2. Description of Related Art

Known electronic components include an element body including a sidesurface and an end surface adjacent to each other and an externalelectrode disposed in the side surface and the end surface (for example,refer to Japanese Unexamined Patent Publication No. H5-144665). Theexternal electrode includes a conductive resin layer disposed over theside surface and the end surface, and a plating layer covering theconductive resin layer.

SUMMARY OF THE INVENTION

The conductive resin layer generally contains a resin and conductiveparticles. The resin tends to absorb moisture. In a case in which theelectronic component is solder-mounted on an electronic device, themoisture absorbed by the resin may be gasified so that volume expansionmay occur. In this case, stress may act on the conductive resin layer,and the conductive resin layer may be cracked and be peeled off. Theconductive particles include, for example, metal. The electronic deviceincludes, for example, a circuit board or an electronic component.

An object of an aspect of the present invention is to provide anelectronic component that controls peel-off of a conductive resin layer.

An electronic component according to an aspect of the present inventionincludes an element body including a side surface and an end surfaceadjacent to each other, and an external electrode disposed on the sidesurface and the end surface. The external electrode includes aconductive resin layer disposed over the side surface and the endsurface, and a plating layer covering the conductive resin layer. Theconductive resin layer includes a first region positioned on the endsurface, a second region positioned on the side surface, and a thirdregion positioned on a ridge portion between the end surface and theside surface. In a case where a maximum thickness of the first region isT1 (μm), a maximum thickness of the second region is T2 (μm), and aminimum thickness of the third region is T3 (μm), the maximum thicknessT1 and the maximum thickness T2 satisfy a relation of

T2/T1≥0.11,

and the maximum thickness T1 and the minimum thickness T3 satisfy arelation of

T3/T1≥0.11.

As a result of research and study by the present inventors, the presentinventors have discovered the following matters.

The plating layer covering the conductive resin layer tends to be incohesive contact with the conductive resin layer, but tends not to be incohesive contact with the element body. Therefore, a gap is formedbetween an end edge of the plating layer and the element body. In a casewhere the moisture absorbed by the resin is gasified, the gas generatedfrom the moisture reaches the gap between the end edge of the platinglayer and the element body, and the gas is emitted outside the externalelectrode through the gap. Since the gas generated from the moisture isemitted outside the external electrode, stress tends not to act on theconductive resin layer. Hereinafter, the gap between the end edge of theplating layer and the element body is referred to as a “gap” simply.

The inventors conducted further research and study on a configuration inwhich the gas generated from the moisture reaches the gap reliably.

The second region of the conductive resin layer is close to the gap, andthus the gas generated from the moisture absorbed by the resin of thesecond region tends to reach the gap. Since the first region is awayfrom the gap, the gas generated from the moisture absorbed by the resinof the first region tends not to reach the gap. In order to emit,outside the external electrode, the gas generated from the moistureabsorbed by the resin of the first region, it is desired to achieve aconfiguration in which the gas generated from the moisture absorbed bythe resin of the first region reaches the gap reliably. In a case inwhich the gas generated from the moisture absorbed by the resin of thefirst region reaches the gap reliably, the gas generated from themoisture absorbed by the resin of the second region also reaches the gapreliably.

The inventors focused on a path through which the gas generated from themoisture absorbed by the resin of the first region reaches the gap.Consequently, the inventors found out that the gas generated from themoisture absorbed by the resin of the first region reaches the gapreliably in a case where a desired relation holds between a thickness ofthe first region, a thickness of the second region, and a thickness ofthe third region. Specifically, in a case where the maximum thickness T1of the first region and the maximum thickness T2 of the second regionsatisfy the relation of

T2/T1≥0.11,

and the maximum thickness T1 and the minimum thickness T3 of the thirdregion satisfy the relation of

T3/T1≥0.11,

the gas generated from the moisture absorbed by the resin of the firstregion passes through the third region and the second region to reachthe gap reliably.

Therefore, in the above-described aspect, the gas generated from themoisture absorbed by the resin of the conductive resin layer (the firstregion) reaches the gap reliably. The gas that has reached the gap isemitted outside the external electrode, so that the stress tends not toact on the conductive resin layer. Consequently, the above-describedaspect controls the peel-off of the conductive resin layer.

In the above-described aspect, the maximum thickness T1 and the maximumthickness T2 may satisfy a relation of

T2/T1≥0.13.

This configuration controls the peel-off of the conductive resin layerreliably.

In the above-described aspect, the maximum thickness T1 and the minimumthickness T3 may satisfy a relation of

T3/T1≥0.12.

This configuration controls the peel-off of the conductive resin layerreliably.

In the above-described aspect, the maximum thickness T1 and the maximumthickness T2 may satisfy a relation of

T2/T1≤0.54.

As a result of research and study by the present inventors, the presentinventors also have discovered the following matters.

The gap is an outlet of the gas generated from the moisture absorbed bythe resin of the conductive resin layer, and is also an inlet ofmoisture to the external electrode. The path through which the gasgenerated from the moisture absorbed by the resin of the first regionreaches the gap may serve as a path through which the moisture reachesthe first region. The moisture that has reached the first region isabsorbed in the first region. In this case, the gas generation amountmay increase. Therefore, in order to reduce the absorption of themoisture in the first region, it is desired to achieve a configurationin which the moisture tends not to reach the first region.

The inventors found out that the moisture tends not to reach the firstregion in a case where a desired relation holds between the thickness ofthe first region and the thickness of the second region. Specifically,in the maximum thickness T1 and the maximum thickness T2 satisfy arelation of

T2/T1≤0.54,

the moisture tends not to reach the first region even in a case in whichthe moisture enters from the gap. Therefore, this configuration reducesan increase in moisture absorbed in the conductive resin layer (thefirst region) and an increase in gas generated from the moisture.Consequently, this configuration further controls the peel-off of theconductive resin layer.

In the above-described aspect, the maximum thickness T1 and the minimumthickness T3 may satisfy a relation of

T3/T1≤0.43.

The inventors also found out that the moisture tends not to reach thefirst region in a case where a desired relation holds between thethickness of the first region and the thickness of the third region.Specifically, in a configuration where the maximum thickness T1 and theminimum thickness T3 satisfy the relation of

T3/T1≤0.43,

the moisture tends not to reach the first region even in a case in whichthe moisture enters from the gap. Therefore, this configuration reducesan increase in moisture absorbed in the conductive resin layer (thefirst region) and an increase in gas generated from the moisture.Consequently, this configuration further controls the peel-off of theconductive resin layer.

The above-described aspect may include a circuit element disposed in theelement body. The element body may include a first portion where thecircuit element is disposed and a second portion where the circuitelement is not disposed. In a case where the first region has athickness of T4 (μm) at a position corresponding to a boundary betweenthe first portion and the second portion, the maximum thickness T1 andthe thickness T4 may satisfy a relation of

T4/T1≥0.11.

As a result of research and study by the present inventors, the presentinventors also have discovered the following matters.

In order to make the gas generated from the moisture absorbed by theresin of the first region reach the gap more reliably, it is desired toachieve a configuration in which the gas reaches the second region morereliably from the first region. The position, in the first region,corresponding to the boundary between the first portion and the secondportion is a position near an end of the first region and is near thethird region. Therefore, in a case in which the gas tends to passthrough the position, in the conductive resin layer, corresponding tothe boundary between the first portion and the second portion, the gastends to reach the third region from the first region.

The inventors focused on the thickness of the first region at theposition corresponding to the boundary between the first portion and thesecond portion. Consequently, the inventors found out that the gasreaches the third region from the first region more reliably in a casewhere the thickness of the first region and the thickness of the firstregion at the position corresponding to the boundary between the firstportion and the second portion satisfy a desired relation. Specifically,in a case where the maximum thickness T1 and the thickness T4 of theconductive resin layer at the position corresponding to the boundarysatisfy the relation of

T4/T1≥0.11,

the gas reaches the third region from the first region more reliably. Inthis configuration, the gas generated from the moisture absorbed by theresin of the conductive resin layer (the first region) reaches the gapmore reliably. Therefore, the stress further tends not to act on theconductive resin layer. Consequently, this configuration furthercontrols the peel-off of the conductive resin layer.

In the above-described aspect, the maximum thickness T1 and thethickness T4 described above may satisfy a relation of

T4/T1≥0.26.

This configuration controls the peel-off of the conductive resin layerreliably.

In the above-described aspect, the maximum thickness T1 and thethickness T4 may satisfy a relation of

T4/T1≤0.55.

As a result of research and study by the present inventors, the presentinventors also have discovered the following matters.

As described above, the path through which the gas generated from themoisture absorbed by the resin of the first region reaches the gap mayserve as a path through which the moisture reaches the first region.Therefore, in order to reduce the absorption of the moisture in thefirst region, it is desired to achieve a configuration in which themoisture tends not to reach the first region.

The inventors found out that the moisture tends not to reach the firstregion in a case where the thickness of the first region and thethickness of the first region at the position corresponding to theboundary between the first portion and the second portion satisfy adesired relation. Specifically, in a configuration where the maximumthickness T1 and the above-described thickness T4 satisfy the relationof

T4/T1≤0.55,

the moisture tends not to reach the first region even in a case in whichthe moisture enters from the gap. Therefore, this configuration reducesan increase in moisture absorbed in the conductive resin layer (thefirst region) and an increase in gas generated from the moisture.Consequently, this configuration further controls the peel-off of theconductive resin layer.

In the above-described aspect, the maximum thickness T2, the minimumthickness T3, and the thickness T4 may satisfy a relation of

T4>T2

and a relation of

T4>T3.

Furthermore, the inventors also found out that the gas reaches thesecond region from the first region more reliably in a case where thethickness of the first region at the position corresponding to theboundary between the first portion and the second portion, the thicknessof the second region, and the thickness of the third region satisfy adesired relation. Specifically, in a case where the maximum thicknessT2, the minimum thickness T3, and the thickness T4 satisfy the relationof

T4>T2

and the relation of

T4>T3,

the gas reaches the second region from the first region more reliably.In this configuration, the gas generated from the moisture absorbed bythe resin of the conductive resin layer (the first region) reaches thegap more reliably. Therefore, the stress tends not to act on theconductive resin layer. Consequently, this configuration furthercontrols the peel-off of the conductive resin layer.

In the above-described aspect, in a cross-section orthogonal to the sidesurface and the end surface, a surface of the second region may curve ina convex shape in a direction away from the side surface.

In this configuration, since the thickness of the second region tendsnot to be small locally, a movement path of the gas in the second regiontends not to be narrow on the movement path. Therefore, thisconfiguration tends not to suppress the movement of the gas in thesecond region. The gas generated from the moisture absorbed by the resinof the conductive resin layer reaches the gap more reliably.Consequently, this configuration controls the peel-off of the conductiveresin layer more reliably.

In the above-described aspect, the external electrode may include asintered metal layer that is disposed over the side surface and the endsurface and is covered with the conductive resin layer. With a planeincluding the end surface as a reference plane, a length from an endedge of the sintered metal layer to an end edge of the second region ina direction orthogonal to the end surface may be larger than a lengthfrom the reference plane to the end edge of the sintered metal layer inthe direction orthogonal to the end surface.

As a result of research and study by the present inventors, the presentinventors also have discovered the following matters.

The degree of cohesive contact between the element body and theconductive resin layer is lower than the degree of cohesive contactbetween the sintered metal layer and the conductive resin layer.Therefore, an interface between the sintered metal layer and theconductive resin layer tends not to contribute to the movement path ofthe gas, and an interface between the element body and the conductiveresin layer tends to contribute as the movement path of the gas.

The inventors focused on a length of the interface between the sinteredmetal layer and the conductive resin layer, and a length of theinterface between the element body and the conductive resin layer.Consequently, the inventors found out that the movement path of the gasincreases in a case where a desired relation holds between the lengthfrom the reference plane to the end edge of the sintered metal layer inthe direction orthogonal to the end surface and the length from the endedge of the sintered metal layer to the end edge of the second region inthe direction orthogonal to the end surface. The movement path of thegas increases in a case where the length from the end edge of thesintered metal layer to the end edge of the second region in thedirection orthogonal to the end surface is larger than the length fromthe reference plane to the end edge of the sintered metal layer in thedirection orthogonal to the end surface. Therefore, in thisconfiguration, the gas generated from the moisture absorbed by the resinof the conductive resin layer tends to move toward the gap. The stressfurther tends not to act on the conductive resin layer. Consequently,this configuration further controls the peel-off of the conductive resinlayer.

In the above-described aspect, when viewed from a direction orthogonalto the side surface, an end edge of the second region may curve.

In this configuration, the length of the end edge of the second regionis larger than that of a configuration in which the end edge of thesecond region has a linear shape. Therefore, in this configuration, aregion from which the gas is emitted is large, and the gas further tendsto be emitted from the external electrode. Consequently, the stressfurther tends not to act on the conductive resin layer.

The present invention will become more fully understood from thedetailed description given hereinafter and the accompanying drawingswhich are given by way of illustration only, and thus are not to beconsidered as limiting the present invention.

Further scope of applicability of the present invention will becomeapparent from the detailed description given hereinafter. However, itshould be understood that the detailed description and specificexamples, while indicating embodiments of the invention, are given byway of illustration only, since various changes and modifications withinthe spirit and scope of the invention will become apparent to thoseskilled in the art from this detailed description.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a perspective view of a multilayer capacitor according to anembodiment;

FIG. 2 is a view illustrating a cross-sectional configuration of themultilayer capacitor according to the embodiment;

FIG. 3 is a view illustrating a cross-sectional configuration of themultilayer capacitor according to the embodiment;

FIG. 4 is a view illustrating a cross-sectional configuration of anexternal electrode;

FIG. 5 is a view illustrating a cross-sectional configuration of theexternal electrode;

FIG. 6 is a plan view illustrating an element body and a secondelectrode layer;

FIG. 7 is a plan view illustrating the element body and the secondelectrode layer;

FIG. 8 is a table illustrating an incidence ratio of peel-off of thesecond electrode layer in each of samples;

FIG. 9 is a view illustrating a cross-sectional configuration of anexternal electrode; and

FIG. 10 is a view illustrating a cross-sectional configuration of theexternal electrode.

DETAILED DESCRIPTION OF EMBODIMENTS

Hereinafter, embodiments of the present invention will be described indetail with reference to the accompanying drawings. In the followingdescription, the same elements or elements having the same functions aredenoted with the same reference numerals and overlapped explanation isomitted.

A configuration of a multilayer capacitor C1 according to an embodimentwill be described with reference to FIGS. 1 to 7. FIG. 1 is aperspective view of a multilayer capacitor according to the embodiment.FIGS. 2 and 3 are views illustrating a cross-sectional configuration ofthe multilayer capacitor according to the embodiment. FIGS. 4 and 5 areviews illustrating a cross-sectional configuration of an externalelectrode. FIGS. 6 and 7 are plan views illustrating an element body anda second electrode layer. In the present embodiment, an electroniccomponent is, for example, the multilayer capacitor C1.

As illustrated in FIG. 1, the multilayer capacitor C1 includes anelement body 3 of a rectangular parallelepiped shape and a plurality ofexternal electrodes 5. In the present embodiment, the multilayercapacitor C1 includes a pair of external electrodes 5. The pair ofexternal electrodes 5 is disposed on the element body 3. The pair ofexternal electrodes 5 is separated from each other. The rectangularparallelepiped shape includes a rectangular parallelepiped shape inwhich corners and ridges are chamfered, and a rectangular parallelepipedshape in which the corners and ridges are rounded.

The element body 3 includes a pair of principal surfaces 3 a opposingeach other, a pair of side surfaces 3 c opposing each other, and a pairof end surfaces 3 e opposing each other. The pair of principal surfaces3 a, the pair of side surfaces 3 c, and the pair of end surfaces 3 ehave a rectangular shape. The direction in which the pair of principalsurfaces 3 a opposes each other is a first direction D1. The directionin which the pair of side surfaces 3 c opposes each other is a seconddirection D2. The direction in which the pair of end surfaces 3 eopposes each other is a third direction D3. The multilayer capacitor C1is solder-mounted on an electronic device. The electronic deviceincludes, for example, a circuit board or an electronic component. Oneprincipal surface 3 a of the multilayer capacitor C1 opposes theelectronic device. The one principal surface 3 a is arranged toconstitute a mounting surface. The one principal surface 3 a is themounting surface. Each of the principal surface 3 a is also a sidesurface included in the element body 3 of the rectangular parallelepipedshape.

The first direction D1 is a direction orthogonal to the respectiveprincipal surfaces 3 a and is orthogonal to the second direction D2. Thethird direction D3 is a direction parallel to the respective principalsurfaces 3 a and the respective side surfaces 3 c, and is orthogonal tothe first direction D1 and the second direction D2. The second directionD2 is a direction orthogonal to the respective side surfaces 3 c. Thethird direction D3 is a direction orthogonal to the respective endsurfaces 3 e. In the present embodiment, a length of the element body 3in the third direction D3 is larger than a length of the element body 3in the first direction D1, and larger than a length of the element body3 in the second direction D2. The third direction D3 is a longitudinaldirection of the element body 3. The length of the element body 3 in thefirst direction D1 and the length of the element body 3 in the seconddirection D2 may be equivalent to each other. The length of the elementbody 3 in the first direction D1 and the length of the element body 3 inthe second direction D2 may be different from each other.

The length of the element body 3 in the first direction D1 is a heightof the element body 3. The length of the element body 3 in the seconddirection D2 is a width of the element body 3. The length of the elementbody 3 in the third direction D3 is a length of the element body 3. Inthe present embodiment, the element body 3 has a height of 0.5 to 2.5mm, a width of 0.5 to 5.0 mm, and a length of 1.0 to 5.7 mm. The elementbody 3 has, for example, a height of 2.5 mm, a width of 2.5 mm, and alength of 3.2 mm.

The pair of side surfaces 3 c extends in the first direction D1 tocouple the pair of principal surfaces 3 a. The pair of side surfaces 3 calso extends in the third direction D3. The pair of end surfaces 3 eextends in the first direction D1 to couple the pair of principalsurfaces 3 a. The pair of end surfaces 3 e extends in the seconddirection D2.

The element body 3 includes four ridge portions 3 g, four ridge portions3 i, and four ridge portions 3 j. The ridge portion 3 g is positionedbetween the end surface 3 e and the principal surface 3 a. The ridgeportion 3 i is positioned between the end surface 3 e and the sidesurface 3 c. The ridge portion 3 j is positioned between the principalsurface 3 a and the side surface 3 c. In the present embodiment, each ofthe ridge portions 3 g, 3 i, and 3 j is rounded to curve. The elementbody 3 is subject to what is called a round chamfering process. The endsurface 3 e and the principal surface 3 a are indirectly adjacent toeach other with the ridge portion 3 g between the end surface 3 e andthe principal surface 3 a. The end surface 3 e and the side surface 3 care indirectly adjacent to each other with the ridge portion 3 i betweenthe end surface 3 e and the side surface 3 c. The principal surface 3 aand the side surface 3 c are indirectly adjacent to each other with theridge portion 3 j between the principal surface 3 a and the side surface3 c.

The element body 3 is configured by laminating a plurality of dielectriclayers in the first direction D1. The element body 3 includes theplurality of laminated dielectric layers. In the element body 3, alamination direction of the plurality of dielectric layers coincideswith the first direction D1. Each dielectric layer includes, forexample, a sintered body of a ceramic green sheet containing adielectric material. The dielectric material includes, for example, adielectric ceramic of BaTiO₃ base, Ba(Ti,Zr)O₃ base, or (Ba,Ca)TiO₃base. In an actual element body 3, each of the dielectric layers isintegrated to such an extent that a boundary between the dielectriclayers cannot be visually recognized. In the element body 3, thelamination direction of the plurality of dielectric layers may coincidewith the second direction D2.

As illustrated in FIGS. 2 and 3, the multilayer capacitor C1 includes aplurality of internal electrodes 7 and a plurality of internalelectrodes 9. Each of the internal electrodes 7 and 9 is an internalconductor disposed in the element body 3. Each of the internalelectrodes 7 and 9 is made of a conductive material that is commonlyused as an internal conductor of a multilayer electronic component. Theconductive material includes, for example, a base metal. The conductivematerial includes, for example, Ni or Cu. Each of the internalelectrodes 7 and 9 is configured as a sintered body of conductive pastecontaining the conductive material described above. In the presentembodiment, the internal electrodes 7 and 9 are made of Ni. In thepresent embodiment, the internal electrodes 7 and 9 constitute a circuitelement disposed in the element body 3.

The internal electrodes 7 and the internal electrodes 9 are disposed indifferent positions (layers) in the first direction D1. The internalelectrodes 7 and the internal electrodes 9 are alternately disposed inthe element body 3 to oppose each other in the first direction D1 withan interval therebetween. Polarities of the internal electrodes 7 andthe internal electrodes 9 are different from each other. In a case inwhich the lamination direction of the plurality of dielectric layers isthe second direction D2, the internal electrodes 7 and the internalelectrodes 9 are disposed in different positions (layers) in the seconddirection D2. One end of each of the internal electrodes 7 and 9 isexposed to a corresponding end surface 3 e of the pair of the endsurfaces 3 e. Each of the internal electrodes 7 and 9 includes the oneend exposed to the corresponding end surface 3 e.

The plurality of internal electrodes 7 and the plurality of internalelectrodes 9 are alternately disposed in the first direction D1. Theinternal electrodes 7 and 9 are positioned in a plane approximatelyparallel to the principal surfaces 3 a. The internal electrodes 7 andthe internal electrodes 9 oppose each other in the first direction D1.The direction (s first direction D1) in which the internal electrodes 7and the internal electrodes 9 oppose each other is orthogonal to thedirection (second direction D2 and third direction D3) parallel to theprincipal surfaces 3 a. In a case in which the lamination direction ofthe plurality of dielectric layers is the second direction D2, theplurality of internal electrodes 7 and the plurality of internalelectrodes 9 are alternately disposed in the second direction D2. Inthis case, the internal electrodes 7 and 9 are positioned in a planeapproximately orthogonal to the principal surfaces 3 a. The internalelectrodes 7 and the internal electrodes 9 oppose each other in thesecond direction D2.

The element body 3 includes an inner layer portion 4 a and a pair ofouter layer portions 4 b. The plurality of internal electrodes 7 and 9is disposed in the inner layer portion 4 a. The inner layer portion 4 ais positioned between the pair of outer layer portions 4 b in the firstdirection D1. The pair of outer layer portions 4 b sandwich the innerlayer portion 4 a therebetween in the first direction D1. None of theinternal electrodes 7 and 9 are disposed in each of the outer layerportions 4 b. In the present embodiment, a boundary between theoutermost internal electrode 7 or 9 of the plurality of internalelectrodes 7 and 9 in the first direction D1 and the outer layer portion4 b constitutes a boundary between the inner layer portion 4 a and theouter layer portion 4 b. In a case in which the inner layer portion 4 aconstitutes a first portion, for example, the outer layer portion 4 bconstitutes a second portion.

As illustrated in FIG. 1, the external electrodes 5 are disposed at bothend portions of the element body 3 in the third direction D3. Each ofthe external electrodes 5 is disposed on the corresponding end surface 3e side of the element body 3. The external electrode 5 is disposed on atleast the end surface 3 e and the principal surface 3 a that is also theside surface. In the present embodiment, each of the external electrode5 is disposed on the pair of principal surface 3 a, the pair of sidesurface 3 c, and the end surface 3 e. As illustrated in FIGS. 2 to 5,the external electrode 5 includes a plurality of electrode portions 5 a,5 c, and 5 e. Each of the electrode portions 5 a is disposed on theprincipal surface 3 a and the ridge portion 3 g. Each of the electrodeportions 5 c is disposed on the side surface 3 c and the ridge portion 3i. The electrode portion 5 e is disposed on the corresponding endsurface 3 e. The external electrode 5 also includes electrode portionsdisposed on the ridge portions 3 j.

The external electrode 5 is formed on the five surfaces, that is, thepair of principal surface 3 a, the end surface 3 e, and the pair of sidesurfaces 3 c, as well as on the ridge portions 3 g, 3 i, and 3 j. Theelectrode portions 5 a, 5 c, and 5 e adjacent each other are coupled andare electrically connected to each other. Each electrode portion 5 ecovers all the one ends of the corresponding internal electrodes 7 or 9.The electrode portion 5 e is directly connected to the correspondinginternal electrodes 7 or 9. The external electrode 5 is electricallyconnected to the corresponding internal electrodes 7 or 9. Asillustrated in FIGS. 4 and 5, the external electrode 5 includes a firstelectrode layer E1, a second electrode layer E2, a third electrode layerE3, and a fourth electrode layer E4. The fourth electrode layer E4 isarranged to constitute the outermost layer of the external electrode 5.Each of the electrode portions 5 a, 5 c, and 5 e includes the firstelectrode layer E1, the second electrode layer E2, the third electrodelayer E3, and the fourth electrode layer E4.

The first electrode layer E1 included in the electrode portion 5 a isdisposed on the ridge portion 3 g, and is not disposed on the principalsurface 3 a. The first electrode layer E1 included in the electrodeportion 5 a is formed to cover the entire ridge portion 3 g. The firstelectrode layer E1 is not formed on the principal surface 3 a. The firstelectrode layer E1 included in the electrode portion 5 a is in contactwith the entire ridge portion 3 g. The principal surface 3 a is notcovered with the first electrode layer E1, and is exposed from the firstelectrode layer E1. The first electrode layer E1 included in theelectrode portion 5 a may be disposed on the principal surface 3 a. Inthis case, the first electrode layer E1 included in the electrodeportion 5 a is formed to cover one part of the principal surface 3 a andthe entire ridge portion 3 g. That is, the first electrode layer E1included in the electrode portion 5 a is also in contact with the onepart of the principal surface 3 a. The one part of the principal surface3 a is, for example, the partial region near the end surface 3 e, in theprincipal surface 3 a.

The second electrode layer E2 included in the electrode portion 5 a isdisposed on the first electrode layer E1 and on the principal surface 3a. In the electrode portion 5 a, the second electrode layer E2 coversthe entire first electrode layer E1. In the electrode portion 5 a, thesecond electrode layer E2 is in contact with the entire first electrodelayer E1. The second electrode layer E2 included in the electrodeportion 5 a is in contact with one part of the principal surface 3 a.The one part of the principal surface 3 a is, for example, the partialregion near the end surface 3 e, in the principal surface 3 a. That is,the one part of the principal surface 3 a is close to the end surface 3e. The electrode portion 5 a is four-layered on the ridge portion 3 g,and is three-layered on the principal surface 3 a. The second electrodelayer E2 included in the electrode portion 5 a is formed to cover theone part of the principal surface 3 a and the entire ridge portion 3 g.As described above, the one part of the principal surface 3 a is, forexample, the partial region near the end surface 3 e, in the principalsurface 3 a. The second electrode layer E2 included in the electrodeportion 5 a indirectly covers the entire ridge portion 3 g and the onepart of the principal surface 3 a in such a manner that the firstelectrode layer E1 is positioned between the second electrode layer E2and the element body 3. The second electrode layer E2 included in theelectrode portion 5 a directly covers the one part of the principalsurface 3 a. The second electrode layer E2 included in the electrodeportion 5 a directly covers an entire portion of the first electrodelayer E1 formed on the ridge portion 3 g. In a case in which the firstelectrode layer E1 included in the electrode portion 5 a is disposed onthe principal surface 3 a, the electrode portion 5 a is four-layered onthe principal surface 3 a and the ridge portion 3 g.

The first electrode layer E1 included in the electrode portion 5 c isdisposed on the ridge portion 3 i, and is not disposed on the sidesurface 3 c. The first electrode layer E1 included in the electrodeportion 5 c is formed to cover the entire ridge portion 3 i. The firstelectrode layer E1 is not formed on the side surface 3 c. The firstelectrode layer E1 included in the electrode portion 5 c is in contactwith the entire ridge portion 3 i. The side surface 3 c is not coveredwith the first electrode layer E1, and is exposed from the firstelectrode layer E1. The first electrode layer E1 included in theelectrode portion 5 c may be disposed on the side surface 3 c. In thiscase, the first electrode layer E1 included in the electrode portion 5 cis formed to cover one part of the side surface 3 c and the entire ridgeportion 3 i. That is, the first electrode layer E1 included in theelectrode portion 5 c is also in contact with the one part of the sidesurface 3 c. The one part of the side surface 3 c is, for example, thepartial region near the end surface 3 e, in the side surface 3 c.

The second electrode layer E2 included in the electrode portion 5 c isdisposed on the first electrode layer E1 and on the side surface 3 c. Inthe electrode portion 5 c, the second electrode layer E2 covers theentire first electrode layer E1. In the electrode portion 5 c, thesecond electrode layer E2 is in contact with the entire first electrodelayer E1. The second electrode layer E2 is in contact with one part ofthe side surface 3 c. The one part of the side surface 3 c is, forexample, a partial region near the end surface 3 e, in the side surface3 c. That is, the one part of the side surface 3 c is close to the endsurface 3 e. The electrode portion 5 c is four-layered on the ridgeportion 3 i, and is three-layered on the side surface 3 c. The secondelectrode layer E2 included in the electrode portion 5 c is formed tocover the entire ridge portion 3 i and the one part of the side surface3 c. As described above, the one part of the side surface 3 c is, forexample, the partial region near the end surface 3 e, in the sidesurface 3 c. The second electrode layer E2 included in the electrodeportion 5 c indirectly covers the entire ridge portion 3 i and the onepart of the side surface 3 c in such a manner that the first electrodelayer E1 is positioned between the second electrode layer E2 and theelement body 3. The second electrode layer E2 included in the electrodeportion 5 c directly covers the one part of the side surface 3 c. Thesecond electrode layer E2 included in the electrode portion 5 c directlycovers the entire portion of the first electrode layer E1 formed on theridge portion 3 i. In a case where the first electrode layer E1 includedin the electrode portion 5 c is disposed on the side surface 3 c, theelectrode portion 5 c is four-layered on the side surface 3 c and theridge portion 3 i.

The second electrode layer E2 included in the electrode portion 5 c maybe formed to cover one part of the ridge portion 3 i and one part of theside surface 3 c. The one part of the ridge portion 3 i is, for example,a partial region near the principal surface 3 a, in the ridge portion 3i. The one part of the side surface 3 c is, for example, a corner regionnear the principal surface 3 a and the end surface 3 e, in the sidesurface 3 c. In this case, the second electrode layer E2 included in theelectrode portion 5 c indirectly covers the one part of the ridgeportion 3 i in such a manner that the first electrode layer E1 ispositioned between the second electrode layer E2 and the ridge portion 3i. The second electrode layer E2 included in the electrode portion 5 cdirectly covers the one part of the side surface 3 c. The secondelectrode layer E2 included in the electrode portion 5 c directly coversa part of the portion of the first electrode layer E1 formed on theridge portion 3 i. That is, the electrode portion 5 c includes a regionwhere the first electrode layer E1 is exposed from the second electrodelayer E2 and a region where the first electrode layer E1 is covered withthe second electrode layer E2. In a case where the second electrodelayer E2 of the electrode portion 5 c is formed to cover the one part ofthe ridge portion 3 i and the one part of the side surface 3 c, asdescribed above, the internal electrodes 7 and the internal electrodes 9may be disposed in different positions (layers) in the second directionD2.

The first electrode layer E1 included in the electrode portion 5 e isdisposed on the end surface 3 e. The end surface 3 e is entirely coveredwith the first electrode layer E1. The first electrode layer E1 includedin the electrode portion 5 e is in contact with the entire end surface 3e. The second electrode layer E2 included in the electrode portion 5 eis disposed on the first electrode layer E1. In the electrode portion 5e, the second electrode layer E2 is in contact with the entire firstelectrode layer E1. The second electrode layer E2 included in theelectrode portion 5 e is formed to cover the entire end surface 3 e. Thesecond electrode layer E2 included in the electrode portion 5 eindirectly covers the entire end surface 3 e in such a manner that thefirst electrode layer E1 is positioned between the second electrodelayer E2 and the end surface 3 e. The second electrode layer E2 includedin the electrode portion 5 e directly covers the entire first electrodelayer E1. In the electrode portion 5 e, the first electrode layer E1 isformed on the end surface 3 e to be coupled to the one ends of thecorresponding internal electrodes 7 or 9.

The second electrode layer E2 included in the electrode portion 5 e maybe formed to cover one part of the end surface 3 e. The one part of theend surface 3 e is, for example, a partial region near the principalsurface 3 a, in the end surface 3 e. In this case, the second electrodelayer E2 included in the electrode portion 5 e indirectly covers the onepart of the end surface 3 e in such a manner that the first electrodelayer E1 is positioned between the second electrode layer E2 and the endsurface 3 e. The second electrode layer E2 included in the electrodeportion 5 e directly covers a part of the portion of the first electrodelayer E1 formed on the end surface 3 e. That is, the electrode portion 5e includes a region where the first electrode layer E1 is exposed fromthe second electrode layer E2 and a region where the first electrodelayer E1 is covered with the second electrode layer E2. In a case wherethe second electrode layer E2 of the electrode portion 5 c is formed tocover the one part of the side surface 3 e, as described above, theinternal electrodes 7 and the internal electrodes 9 may be disposed indifferent positions (layers) in the second direction D2.

The first electrode layer E1 is formed by sintering conductive pasteapplied onto a surface of the element body 3. The first electrode layerE1 is formed to cover the end surface 3 e and the ridge portions 3 g, 3i, and 3 j. The first electrode layer E1 is formed by sintering a metalcomponent (metal powder) contained in the conductive paste. The firstelectrode layer E1 includes a sintered metal layer. The first electrodelayer E1 includes a sintered metal layer formed on the element body 3.In the present embodiment, the first electrode layer E1 is a sinteredmetal layer made of Cu. The first electrode layer E1 may be a sinteredmetal layer made of Ni. The first electrode layer E1 contains a basemetal. The conductive paste contains, for example, powder made of Cu orNi, a glass component, an organic binder, and an organic solvent. Thefirst electrode layer E1 included in the electrode portion 5 a, thefirst electrode layer E1 included in the electrode portion 5 c, and thefirst electrode layer E1 included in the electrode portion 5 e areintegrally formed.

The second electrode layer E2 is formed by curing conductive resin pasteapplied onto the first electrode layer E1, the principal surface 3 a,and the pair of side surfaces 3 c. The second electrode layer E2 isformed over the first electrode layer E1 and the element body 3. Thefirst electrode layer E1 is an underlying metal layer for forming thesecond electrode layer E2. The second electrode layer E2 is a conductiveresin layer covering the first electrode layer E1. The second electrodelayer E2 includes a conductive resin layer. The conductive resin pastecontains, for example, a resin, a conductive material, and an organicsolvent. The resin is, for example, a thermosetting resin. Theconductive material includes, for example, metal powder. The metalpowder includes, for example, Ag powder or Cu powder. The thermosettingresin includes, for example, a phenolic resin, an acrylic resin, asilicone resin, an epoxy resin, or a polyimide resin. The secondelectrode layer E2 is in contact with the partial region of the ridgeportion 3 j. The second electrode layer E2 included in the electrodeportion 5 a, the second electrode layer E2 included in the electrodeportion 5 c, and the second electrode layer E2 included in the electrodeportion 5 e are integrally formed.

The third electrode layer E3 is formed on the second electrode layer E2by plating method. In the present embodiment, the third electrode layerE3 is formed on the second electrode layer E2 by Ni plating. The thirdelectrode layer E3 is a Ni plating layer. The third electrode layer E3may be an Sn plating layer, a Cu plating layer, or an Au plating layer.The third electrode layer E3 contains Ni, Sn, Cu, or Au. The Ni platinglayer has better solder leach resistance than the metal contained in thesecond electrode layer E2. The third electrode layer E3 covers thesecond electrode layer E2.

The fourth electrode layer E4 is formed on the third electrode layer E3by plating method. The fourth electrode layer E4 includes a solderplating layer. In the present embodiment, the fourth electrode layer E4is formed on the third electrode layer E3 by Sn plating. The fourthelectrode layer E4 is an Sn plating layer. The fourth electrode layer E4may be an Sn—Ag alloy plating layer, an Sn—Bi alloy plating layer, or anSn—Cu alloy plating layer. The fourth electrode layer E4 contains Sn,Sn—Ag alloy, Sn—Bi alloy, or Sn—Cu alloy.

The third electrode layer E3 and the fourth electrode layer E4constitute a plating layer PL formed on the second electrode layer E2.In the present embodiment, the plating layer PL formed on the secondelectrode layer E2 is two-layered. The plating layer PL covers thesecond electrode layer E2. The third electrode layer E3 is anintermediate plating layer positioned between the fourth electrode layerE4 arranged to constitute the outermost layer and the second electrodelayer E2. The third electrode layer E3 included in the electrode portion5 a, the third electrode layer E3 included in the electrode portion 5 c,and the third electrode layer E3 included in the electrode portion 5 eare integrally formed. The fourth electrode layer E4 included in theelectrode portion 5 a, the fourth electrode layer E4 included in theelectrode portion 5 c, and the fourth electrode layer E4 included in theelectrode portion 5 e are integrally formed.

As illustrated in FIG. 4, the second electrode layer E2 includes aregion E2 ₁ positioned on the end surface 3 e, a region E2 ₂ positionedon each of the principal surfaces 3 a, and a region E2 ₃ positioned oneach of the ridge portions 3 g. The region E2 ₁ includes the secondelectrode layer E2 of the electrode portion 5 e. The region E2 ₂ and theregion E2 ₃ include the second electrode layer E2 of the electrodeportion 5 a. The region E2 ₃ is positioned between the region E2 ₁ andthe region E2 ₂. The region E2 ₃ couples the region E2 ₁ and the regionE2 ₂. The region E2 ₁ and the region E2 ₃ are continuous, and the regionE2 ₂ and the region E2 ₃ are continuous. The second electrode layer E2is disposed over the end surface 3 e and the principal surface 3 a. In acase where the region E2 ₁ constitutes a first region, for example, theregion E2 ₂ constitutes a second region and the region E2 ₃ constitutesa third region.

A maximum thickness T1 (μm) of the region E2 ₁ and a maximum thicknessT2 (μm) of the region E2 ₂ satisfy a relation of

T2/T1≥0.11.

The maximum thickness T1 and the maximum thickness T2 may satisfy arelation of

T2/T1≥0.13.

The maximum thickness T1 and a minimum thickness T3 (μm) of the regionE2 ₃ satisfy a relation of

T3/T1≥0.11.

The maximum thickness T1 and the minimum thickness T3 may satisfy arelation of

T3/T1≥0.12.

The maximum thickness T1 is a maximum thickness of the second electrodelayer E2 on the end surface 3 e. The maximum thickness T2 is a maximumthickness of the second electrode layer E2 on the principal surface 3 a.The minimum thickness T3 is a minimum thickness of the second electrodelayer E2 on the ridge portion 3 g.

The maximum thickness T1 and the maximum thickness T2 may satisfy arelation of

T2/T1≤0.54.

The maximum thickness T1 and the minimum thickness T3 may satisfy arelation of

T3/T1≤0.43.

A thickness T4 (μm) of the region E2 ₁ at a position corresponding to aboundary BP between the inner layer portion 4 a and the outer layerportion 4 b and the maximum thickness T1 of the region E2 ₁ satisfy arelation of

T4/T1≥0.11.

The thickness T4 and the maximum thickness T1 may satisfy a relation of

T4/T1≥0.26.

The thickness T4 and the maximum thickness T1 may satisfy a relation of

T4/T1≤0.55.

The maximum thickness T2, the minimum thickness T3, and the thickness T4satisfy a relation of

T4>T2

and a relation of

T4>T3.

The maximum thickness T1, the maximum thickness T2, the minimumthickness T3, and the thickness T4 can be determined, for example, asfollows.

A cross-sectional photograph of the multilayer capacitor C1 includingthe second electrode layer E2 is obtained. The cross-sectionalphotograph is obtained, for example, by capturing a cross-section of themultilayer capacitor C1 taken along a plane that is parallel to the pairof side surfaces 3 c and is equidistant from the pair of side surfaces 3c. Each of the thicknesses T1, T2, T3, and T4 of the second electrodelayer E2 on the obtained cross-sectional photograph is calculated. Themaximum thickness T1 is a maximum value of the thickness of the regionE2 ₁ in the third direction D3. The maximum thickness T2 is a maximumvalue of the thickness of the region E2 ₂ in the first direction D1. Theminimum thickness T3 is a minimum value of the thickness of the regionE2 ₃. The thickness of the region E2 ₃ is, for example, a thickness ofthe ridge portion 3 g in the normal direction.

As illustrated in FIG. 5, the second electrode layer E2 includes aregion E2 ₄ positioned on each of the side surfaces 3 c and a region E2₅ positioned on each of the ridge portions 3 i. The region E2 ₄ and theregion E2 ₅ include the second electrode layer E2 of the electrodeportion 5 c. The region E2 ₅ is positioned between the region E2 ₁ andthe region E2 ₄. The region E2 ₅ couples the region E2 ₁ and the regionE2 ₄. The region E2 ₁ and the region E2 ₅ are continuous, and the regionE2 ₄ and the region E2 ₅ are continuous. The second electrode layer E2is disposed over the end surface 3 e and the side surface 3 c. In a casewhere the region E2 ₁ constitutes the first region, for example, theregion E2 ₄ constitutes a fourth region and the region E2 ₅ constitutesa fifth region.

A maximum thickness T1 (μm) of the region E2 ₁ and a maximum thicknessT5 (μm) of the region E2 ₄ satisfy a relation of

T5/T1≥0.11.

The maximum thickness T1 and the maximum thickness T5 may satisfy arelation of

T5/T1≥0.13.

The maximum thickness T1 and a minimum thickness T6 (μm) of the regionE2 ₅ satisfy a relation of

T6/T1≥0.11.

The maximum thickness T1 and the minimum thickness T6 may satisfy arelation of

T6/T1≥0.12.

The maximum thickness T5 is a maximum thickness of the second electrodelayer E2 on the side surface 3 c. The minimum thickness T6 is a minimumthickness of the second electrode layer E2 on the ridge portion 3 i.

The maximum thickness T1 of the region E2 ₁ and the maximum thickness T5of the region E2 ₄ may satisfy a relation of

T5/T1≤0.54.

The maximum thickness T1 of the region E2 ₁ and the minimum thickness T6of the region E2 ₅ may satisfy a relation of

T6/T1≤0.43.

In the present embodiment, the maximum thickness T2 is equal to themaximum thickness T5, and the minimum thickness T3 is equal to theminimum thickness T6. The term “equal” herein does not necessarily meanonly that values are matched. Even in a case where values include aslight difference in a predetermined range, a manufacturing error, or ameasurement error, it can be defined that the values are equal to eachother.

The maximum thickness T5, and the minimum thickness T6 can bedetermined, for example, as follows.

A cross-sectional photograph of the multilayer capacitor C1 includingthe second electrode layer E2 is obtained. The cross-sectionalphotograph is obtained, for example, by capturing a cross-section of themultilayer capacitor C1 taken along a plane that is parallel to the pairof principal surfaces 3 a and is equidistant from the pair of principalsurfaces 3 a. Each of the thicknesses T5 and T6 of the second electrodelayer E2 on the obtained cross-sectional photograph is calculated. Themaximum thickness T5 is a maximum value of the thickness of the regionE2 ₄ in the first direction D1. The minimum thickness T6 is a minimumvalue of the thickness of the region E2 ₅. The thickness of the regionE2 ₅ is, for example, a thickness of the ridge portion 3 i in the normaldirection.

As illustrated in FIG. 4, in a cross-section orthogonal to the principalsurface 3 a and the end surface 3 e, a surface of the region E2 ₂ curvesin a convex shape in a direction away from the principal surface 3 a.The thickness of the region E2 ₂ is gradually reduced from a position ofthe maximum thickness of the region E2 ₂ toward an end edge of theregion E2 ₂. In the present embodiment, the surface of the region E2 ₂curves due to the change in thickness of the region E2 ₂.

As illustrated in FIG. 5, in a cross-section orthogonal to the sidesurface 3 c and the end surface 3 e, a surface of the region E2 ₄ curvesin a convex shape in a direction away from the side surface 3 c. Thethickness of the region E2 ₄ is gradually reduced from a position of themaximum thickness of the region E2 ₄ toward an end edge of the region E2₄. In the present embodiment, the surface of the region E2 ₄ curves dueto the change in thickness of the region E2 ₄.

As illustrated in FIG. 6, when viewed from the first direction D1, theend edge of the region E2 ₂ curves. In the present embodiment, whenviewed from the first direction D1, a length of the region E2 ₂ in thethird direction D3 is larger at the center of the region E2 ₂ in thesecond direction D2 than in an end of the region E2 ₂ in the seconddirection D2. The length of the region E2 ₂ in the third direction D3 islargest at the center of the region E2 ₂ in the second direction D2, andis gradually reduced toward the end of the region E2 ₂ in the seconddirection D2.

As illustrated in FIG. 7, when viewed from the second direction D2, theend edge of the region E2 ₄ curves. In the present embodiment, whenviewed from the second direction D2, a length of the region E2 ₄ in thethird direction D3 is larger at the center of the region E2 ₄ in thefirst direction D1 than in an end of the region E2 ₄ in the firstdirection D1. The length of the region E2 ₄ in the third direction D3 islargest at the center of the region E2 ₄ in the first direction D1, andis gradually reduced toward the end of the region E2 ₄ in the firstdirection D1.

As illustrated in FIGS. 4 and 5, the plating layer PL (the thirdelectrode layer E3 and the fourth electrode layer E4) includes a portionPL1 positioned on the region E2 ₂ and a portion PL2 positioned on theregion E2 ₄. The portion PL1 includes an end edge PL1 e. The portion PL2includes an end edge PL2 e. As illustrated in FIG. 4, a gap G1 is formedbetween the end edge PL1 e and the element body 3 (principal surface 3a). As illustrated in FIG. 5, a gap G2 is formed between the end edgePL2 e and the element body 3 (side surface 3 c). A width of each of thegaps G1 and G2 is, for example, larger than 0 (zero) and equal to orsmaller than 3 μm. The widths of the gaps G1 and G2 may be the same aseach other. The widths of the gaps G1 and G2 may be different from eachother.

The relationship among the maximum thickness T1, the maximum thicknessT2, the minimum thickness T3, and the thickness T4 is described.

The inventors carried out the following experiment in order to clarify arange of the maximum thickness T1, a range of the maximum thickness T2,a range of the minimum thickness T3, and a range of the thickness T4.That it, the inventors prepared samples 1 to 11 that are different fromone another in the maximum thickness T1, the maximum thickness T2, andthe minimum thickness T3, and the thickness T4, and confirmed anincidence ratio of peel-off of the second electrode layer E2 in each ofthe samples 1 to 11. The result is illustrated in FIG. 8. FIG. 8 is atable illustrating the incidence ratio of the peel-off of the secondelectrode layer in each of the samples 1 to 11.

Each of the samples 1 to 11 is a lot including a plurality of specimens.As described below, the specimens of the samples 1 to 11 are multilayercapacitors having the same configuration as one another except for thethicknesses T1, T2, T3, and T4. In the specimens of the samples 1 to 11,the element body 3 has a height of 2.5 mm, a width of 2.5 mm, and alength of 3.2 mm.

Each of the specimens of the sample 1 has the maximum thickness T1 of 58μm, the maximum thickness T2 of 23 μm, the minimum thickness T3 of 5 μm,and the thickness T4 of 5 μm.

Each of the specimens of the sample 2 has the maximum thickness T1 of 80μm, the maximum thickness T2 of 9 μm, the minimum thickness T3 of 6 μm,and the thickness T4 of 10 μm.

Each of the specimens of the sample 3 has the maximum thickness T1 of118 μm, the maximum thickness T2 of 13 μm, the minimum thickness T3 of12 μm, and the thickness T4 of 14 μm.

Each of the specimens of the sample 4 has the maximum thickness T1 of120 μm, the maximum thickness T2 of 13 μm, the minimum thickness T3 of13 μm, and the thickness T4 of 12 μm.

Each of the specimens of the sample 5 has the maximum thickness T1 of122 μm, the maximum thickness T2 of 15 μm, the minimum thickness T3 of15 μm, and the thickness T4 of 13 μm.

Each of the specimens of the sample 6 has the maximum thickness T1 of121 μm, the maximum thickness T2 of 16 μm, the minimum thickness T3 of14 μm, and the thickness T4 of 31 μm.

Each of the specimens of the sample 7 has the maximum thickness T1 of121 μm, the maximum thickness T2 of 17 μm, the minimum thickness T3 of15 μm, and the thickness T4 of 47 μm.

Each of the specimens of the sample 8 has the maximum thickness T1 of125 μm, the maximum thickness T2 of 25 μm, the minimum thickness T3 of32 μm, and the thickness T4 of 33 μm.

Each of the specimens of the sample 9 has the maximum thickness T1 of127 μm, the maximum thickness T2 of 43 μm, the minimum thickness T3 of26 μm, and the thickness T4 of 53 μm.

Each of the specimens of the sample 10 has the maximum thickness T1 of102 μm, the maximum thickness T2 of 52 μm, the minimum thickness T3 of37 μm, and the thickness T4 of 54 μm.

Each of the specimens of the sample 11 has the maximum thickness T1 of94 μm, the maximum thickness T2 of 51 μm, the minimum thickness T3 of 40μm, and the thickness T4 of 52 μm.

The incidence ratio of the peel-off of the second electrode layer E2 wasdetermined as follows.

As for each of the samples 1 to 11, twelve specimens were selected andthe selected specimens were left in a thermo-hygrostat chamber for fivehours. In the thermo-hygrostat chamber, the temperature is 121° C. andthe relative humidity is 95%. After that, a reflow test was conductedthree times on the specimens in a nitrogen atmosphere. In the reflowtest, a peak temperature is 260° C.

After the reflow test, the specimens were cut along a plane orthogonalto the end surface 3 e, and whether there is peel-off of the secondelectrode layer E2 in the cut surface was visually confirmed. The numberof specimens in which peel-off occurs in the second electrode layer E2was counted to calculate an incidence ratio (%) of the peel-off of thesecond electrode layer E2.

As a result of the experiment described above, as illustrated in FIG. 8,the inventors confirmed that, as compared with the samples 1 to 3, theincidence ratio of the peel-off of the second electrode layer E2 issignificantly reduced in the samples 4 to 11. In the samples 6 to 10,there was no specimen in which peel-off occurs in the second electrodelayer E2.

Description of the relationship among the maximum thickness T1, themaximum thickness T5, and the minimum thickness T6 is omitted. In thepresent embodiment, the maximum thickness T2 is equal to the maximumthickness T5, and the minimum thickness T3 is equal to the minimumthickness T6; therefore, it is clear that the relationship among themaximum thickness T1, the maximum thickness T5, and the minimumthickness T6 is similar to the relationship among the maximum thicknessT1, the maximum thickness T2, and the minimum thickness T3.

The plating layer PL covering the second electrode layer E2 tends to becohesive contact with the second electrode layer E2, but tends not to becohesive contact with the element body 3. This forms the gap G1 betweenthe end edge PL1 e of the plating layer PL and the element body 3. Evenin a case where the moisture absorbed by the resin included in thesecond electrode layer E2 is gasified, the gas generated from themoisture reaches the gap G1, and the gas is emitted outside the externalelectrode 5 through the gap G1. Since the gas generated from themoisture is emitted outside the external electrode 5, stress tends notto act on the second electrode layer E2.

In the multilayer capacitor C1, the maximum thickness T1 and the maximumthickness T2 satisfy the relation of

T2/T1≥0.11,

and the maximum thickness T1 and the minimum thickness T3 satisfy therelation of

T3/T1≥0.11.

Therefore, the gas generated from the moisture absorbed by the resin ofthe region E2 ₁ passes through the region E2 ₃ and the region E2 ₂ toreach the gap G1 reliably. The region E2 ₂ is closer to the gap G1 thanto the region E2 ₁. In a case in which the gas generated from themoisture absorbed by the resin of the region E2 ₁ reaches the gap G1reliably, then the gas generated from the moisture absorbed by the resinof the region E2 ₂ also reaches the gap G1 reliably.

In the multilayer capacitor C1, the gas generated from the moistureabsorbed by the resin of the second electrode layer E2 (the region E2 ₁)reaches the gap G1 reliably. The gas that has reached the gap G1 isemitted outside the external electrode 5, so that the stress tends notto act on the second electrode layer E2. Consequently, the multilayercapacitor C1 controls the peel-off of the second electrode layer E2.

In the multilayer capacitor C1, the maximum thickness T1 and the maximumthickness T2 satisfy a relation of

T2/T1≥0.13.

Therefore, the multilayer capacitor C1 controls the peel-off of theconductive resin layer reliably.

In the multilayer capacitor C1, the maximum thickness T1 and the minimumthickness T3 satisfy a relation of

T3/T1≥0.12.

Therefore, the multilayer capacitor C1 controls the peel-off of theconductive resin layer reliably.

The gap G1 is an outlet of the gas generated from the moisture absorbedby the resin of the second electrode layer E2, and is also an inlet ofthe moisture to the external electrode 5. The path through which the gasgenerated from the moisture absorbed by the resin of the region E2 ₁reaches the gap G1 may serve as a path through which the moisturereaches the region E2 ₁. The moisture that has reached the region E2 ₁is absorbed in the region E2 ₁. In this case, the gas generation amountmay increase.

In the multilayer capacitor C1, since the maximum thickness T1 and themaximum thickness T2 satisfy the relation of

T2/T1≤0.54,

the moisture tends not to reach the region E2 ₁ even in a case in whichthe moisture enters from the gap G1. Therefore, the multilayer capacitorC1 reduces an increase in moisture absorbed in the second electrodelayer E2 (the region E2 ₁) and an increase in gas generated from themoisture. Consequently, the multilayer capacitor C1 further controls thepeel-off of the second electrode layer E2. In a case where the maximumthickness T1 and the maximum thickness T2 satisfy the relation of

T2/T1≤0.51,

the multilayer capacitor C1 controls the peel-off of the secondelectrode layer E2 more reliably.

In the multilayer capacitor C1, since the maximum thickness T1 and theminimum thickness T3 satisfy the relation of

T3/T1≤0.43,

the moisture tends not to reach the region E2 ₁ even in a case in whichthe moisture enters from the gap G1. Therefore, the multilayer capacitorC1 reduces an increase in moisture absorbed in the second electrodelayer E2 (the region E2 ₁) and an increase in gas generated from themoisture. Consequently, the multilayer capacitor C1 further controls thepeel-off of the second electrode layer E2. In a case where the maximumthickness T1 and the minimum thickness T3 satisfy the relation of

T3/T1≤0.36,

the multilayer capacitor C1 controls the peel-off of the secondelectrode layer E2 more reliably.

The position, in the region E2 ₁, corresponding to the boundary BPbetween the inner layer portion 4 a and the outer layer portion 4 b is aposition near an end of the region E2 ₁ and is near the region E2 ₃.Therefore, in a case in which the gas tends to pass through the positionof the second electrode layer E2 corresponding to the boundary BP, thegas tends to reach the region E2 ₃ from the region E2 ₁.

In the multilayer capacitor C1, since the maximum thickness T1 and thethickness T4 satisfy the relation of

T4/T1≥0.11,

the gas reaches the region E2 ₃ from the region E2 ₁ more reliably.Therefore, in the multilayer capacitor C1, the gas generated from themoisture absorbed by the resin of the second electrode layer E2 (theregion E2 ₁) reaches the gap G1 more reliably. The stress further tendsnot to act on the second electrode layer E2. Consequently, themultilayer capacitor C1 further controls the peel-off of the secondelectrode layer E2.

In the multilayer capacitor C1, the maximum thickness T1 and thethickness T4 satisfy the relation of

T4/T1≥0.26.

Therefore, the multilayer capacitor C1 controls the peel-off of thesecond electrode layer E2 reliably.

As described above, the path through which the gas generated from themoisture absorbed by the resin of the region E2 ₁ reaches the gap G1 mayserve as a path through which the moisture reaches the region E2 ₁.

In the multilayer capacitor C1, since the maximum thickness T1 and theabove-described thickness T4 satisfy the relation of

T4/T1≤0.55,

the moisture tends not to reach the region E2 ₁ even in a case in whichthe moisture enters from the gap G1. Therefore, the multilayer capacitorC1 reduces an increase in moisture absorbed in the second electrodelayer E2 (the region E2 ₁) and an increase in gas generated from themoisture. Consequently, the multilayer capacitor C1 further controls thepeel-off of the second electrode layer E2. In a case where the maximumthickness T1 and the above-described thickness T4 satisfy the relationof

T4/T1≤0.53,

the multilayer capacitor C1 controls the peel-off of the secondelectrode layer E2 more reliably.

In the multilayer capacitor C1, since the maximum thickness T2, theminimum thickness T3, and the thickness T4 satisfy the relation of

T4>T2

and the relation of

T4>T3,

the gas reaches the region E2 ₂ from the region E2 ₁ more reliably.Therefore, in the multilayer capacitor C1, the gas generated from themoisture absorbed by the resin of the second electrode layer E2 (theregion E2 ₁) reaches the gap G1 more reliably. The stress further tendsnot to act on the second electrode layer E2. Consequently, themultilayer capacitor C1 further controls the peel-off of the secondelectrode layer E2.

In the multilayer capacitor C1, in the cross-section orthogonal to theprincipal surface 3 a and the end surface 3 e, the surface of the regionE2 ₂ curves in the convex shape in the direction away from the principalsurface 3 a.

In the configuration where the surface of the region E2 ₂ curves in theconvex shape in the direction away from the principal surface 3 a, sincethe thickness of the region E2 ₂ tends not to be small locally, amovement path of the gas in the region E2 ₂ tends not to be narrow onthe movement path. Therefore, the multilayer capacitor C1 tends not tosuppress the movement of the gas in the region E2 ₂. The gas generatedfrom the moisture absorbed by the resin of the second electrode layer E2reaches the gap G1 more reliably. Consequently, the multilayer capacitorC1 controls the peel-off of the second electrode layer E2 more reliably.

In the multilayer capacitor C1, in the cross-section orthogonal to theside surface 3 c and the end surface 3 e, the surface of the region E2 ₄curves in the convex shape in the direction away from the side surface 3c.

In the configuration where the surface of the region E2 ₄ curves in theconvex shape in the direction away from the side surface 3 c, since thethickness of the region E2 ₄ tends not to be small locally, a movementpath of the gas in the region E2 ₄ tends not to be narrow on themovement path. Therefore, the multilayer capacitor C1 tends not tosuppress the movement of the gas in the region E2 ₄. The gas generatedfrom the moisture absorbed by the resin of the second electrode layer E2reaches the gap G2 more reliably. Consequently, the multilayer capacitorC1 controls the peel-off of the second electrode layer E2 more reliably.

In the multilayer capacitor C1, when viewed from the first direction D1,the end edge Ee₂ of the region E2 ₂ curves.

In the configuration where the end edge of the region E2 ₂ curves, thelength of the end edge of the region E2 ₂ is larger than that of aconfiguration where the end edge of the region E2 ₂ has a linear shape.Therefore, in the multilayer capacitor C1, a region from which the gasis emitted is large, and the gas further tends to be emitted from theexternal electrode 5. Consequently, the stress further tends not to acton the second electrode layer E2.

In the multilayer capacitor C1, when viewed from the second directionD2, the end edge Ee₂ of the region E2 ₄ curves.

In the configuration where the end edge of the region E2 ₄ curves, thelength of the end edge of the region E2 ₄ is larger than that of aconfiguration where the end edge of the region E2 ₄ has a linear shape.Therefore, in the multilayer capacitor C1, a region from which the gasis emitted is large, and the gas further tends to be emitted from theexternal electrode 5. Consequently, the stress further tends not to acton the second electrode layer E2.

In the multilayer capacitor C1, the maximum thickness T1 of the firstregion and the maximum thickness T5 of the second region satisfy therelation of

T5/T1≥0.11,

and the maximum thickness T1 and the minimum thickness T6 of the thirdregion satisfy the relation of

T6/T1≥0.11.

As described above, the gas generated from the moisture absorbed by theresin of the region E2 ₁ passes through the region E2 ₅ and the regionE2 ₄ to reach the gap G2 reliably. The region E2 ₄ is closer to the gapG2 than to the region E2 ₁. In a case in which the gas generated fromthe moisture absorbed by the resin of the region E2 ₁ reaches the gap G2reliably, then the gas generated from the moisture absorbed by the resinof the region E2 ₄ also reaches the gap G2 reliably.

In the multilayer capacitor C1, the gas generated from the moistureabsorbed by the resin of the second electrode layer E2 (the region E2 ₁)reaches the gap G2 reliably. The gas that has reached the gap G2 isemitted outside the external electrode 5, so that the stress tends notto act on the second electrode layer E2. Consequently, the multilayercapacitor C1 further controls the peel-off of the second electrode layerE2.

In the multilayer capacitor C1, the maximum thickness T1 and the maximumthickness T5 satisfy a relation of

T5/T1≥0.13.

Therefore, the multilayer capacitor C1 further controls the peel-off ofthe conductive resin layer reliably.

In the multilayer capacitor C1, the maximum thickness T1 and the minimumthickness T6 satisfy a relation of

T6/T1≥0.12.

Therefore, the multilayer capacitor C1 further controls the peel-off ofthe conductive resin layer reliably.

The gap G2 is an outlet of the gas generated from the moisture absorbedby the resin of the second electrode layer E2, and is also an inlet ofthe moisture to the external electrode 5. The path through which the gasgenerated from the moisture absorbed by the resin of the region E2 ₁reaches the gap G2 may serve as a path through which the moisturereaches the region E2 ₁. The moisture that has reached the region E2 ₁is absorbed in the region E2 ₁. In this case, the gas generation amountmay increase.

In the multilayer capacitor C1, since the maximum thickness T1 and themaximum thickness T5 satisfy the relation of

T5/T1≤0.54,

the moisture tends not to reach the region E2 ₁ even in a case in whichthe moisture enters from the gap G2. Therefore, the multilayer capacitorC1 reduces an increase in moisture absorbed in the second electrodelayer E2 (the region E2 ₁) and an increase in gas generated from themoisture. Consequently, the multilayer capacitor C1 further controls thepeel-off of the second electrode layer E2. In a case where the maximumthickness T1 and the maximum thickness T5 satisfy the relation of

T5/T1≤0.51,

the multilayer capacitor C1 controls the peel-off of the secondelectrode layer E2 more reliably.

In the multilayer capacitor C1, since the maximum thickness T1 and theminimum thickness T6 satisfy the relation of

T6/T1≤0.43,

the moisture tends not to reach the region E2 ₁ even in a case in whichthe moisture enters from the gap G2. Therefore, the multilayer capacitorC1 reduces an increase in moisture absorbed in the second electrodelayer E2 (the region E2 ₁) and an increase in gas generated from themoisture. Consequently, the multilayer capacitor C1 further controls thepeel-off of the second electrode layer E2. In a case where the maximumthickness T1 and the minimum thickness T6 satisfy the relation of

T6/T1≤0.36,

the multilayer capacitor C1 controls the peel-off of the secondelectrode layer E2 more reliably.

A configuration of a multilayer capacitor according to a modification ofthe present embodiment will be described with reference to FIGS. 9 and10. FIGS. 9 and 10 are views illustrating a cross-sectionalconfiguration of an external electrode. The multilayer capacitoraccording to the modification is generally similar to or the same as themultilayer capacitor C1 described above. However, the configuration ofthe first electrode layer E1 of the modification is different from thatin the embodiment described above. Hereinafter, a difference between theembodiment and the modification will be mainly described.

The multilayer capacitor according to the modification includes theelement body 3 and the plurality of external electrodes 5, as with themultilayer capacitor C1. Each of the external electrodes 5 includes theplurality of electrode portions 5 a, 5 c, and 5 e. Each of the externalelectrodes 5 includes the first electrode layer E1, the second electrodelayer E2, the third electrode layer E3, and the fourth electrode layerE4. The multilayer capacitor according to the modification also includesthe plurality of internal electrodes 7 and the plurality of internalelectrodes 9, although not illustrated in the drawing.

As illustrated in FIG. 9, the first electrode layer E1 of the electrodeportion 5 a is disposed on the principal surface 3 a. The firstelectrode layer E1 of the electrode portion 5 a is formed to cover apart of the principal surface 3 a and the entirety of the ridge portion3 g. The first electrode layer E1 is disposed over the principal surface3 a and the end surface 3 e. The first electrode layer E1 of theelectrode portion 5 a is in contact with a part of the principal surface3 a. The part of the principal surface 3 a is, for example, the partialregion close to the end surface 3 e, in the principal surface 3 a.

A length L1 from the end edge of the first electrode layer E1 to the endedge of the region E2 ₂ in the third direction D3 is larger than alength L2 from a reference plane RP to the end edge of the firstelectrode layer E1 in the third direction D3. The reference plane RP isa plane including the end surface 3 e.

Each of the lengths L1 and L2 can be determined, for example, asfollows.

A cross-sectional photograph of the multilayer capacitor including thefirst electrode layer E1 and the second electrode layer E2 is obtained.The cross-sectional photograph is obtained, for example, by capturing across-section of the multilayer capacitor taken along a plane that isparallel to the pair of side surfaces 3 c and is equidistant from thepair of side surfaces 3 c. Each of the lengths L1 and L2 on the obtainedcross-sectional photograph is calculated.

As illustrated in FIG. 10, the first electrode layer E1 of the electrodeportion 5 c is also disposed on the side surface 3 c. The firstelectrode layer E1 of the electrode portion 5 c is formed to cover apart of the side surface 3 c and the entirety of the ridge portion 3 i.The first electrode layer E1 is disposed over the side surface 3 c andthe end surface 3 e. The first electrode layer E1 of the electrodeportion 5 c is in contact with a part of the side surface 3 c. The partof the side surface 3 c is, for example, the partial region close to theend surface 3 e, in the side surface 3 c.

A length L3 from the end edge of the first electrode layer E1 to the endedge of the region E2 ₄ in the third direction D3 is larger than alength L4 from a reference plane RP to the end edge of the firstelectrode layer E1 in the third direction D3. The reference plane RP isa plane including the end surface 3 e.

Each of the lengths L3 and L4 can be determined, for example, asfollows.

A cross-sectional photograph of the multilayer capacitor including thefirst electrode layer E1 and the second electrode layer E2 is obtained.The cross-sectional photograph is obtained, for example, by capturing across-section of the multilayer capacitor taken along a plane that isparallel to the pair of principal surfaces 3 a and is equidistant fromthe pair of principal surfaces 3 a. Each of the lengths L3 and L4 on theobtained cross-sectional photograph is calculated.

The degree of cohesive contact between the element body 3 and the secondelectrode layer E2 is lower than the degree of cohesive contact betweenthe first electrode layer E1 and the second electrode layer E2.Therefore, an interface between the first electrode layer E1 and thesecond electrode layer E2 tends not to contribute to the movement pathof the gas, and an interface between the element body 3 and the secondelectrode layer E2 tends to contribute as the movement path of the gas.

The configuration where the length L1 is larger than the length L2 hasmore movement paths of the gas than a configuration where the length L1is equal to or smaller than the length L2. In the present modification,the gas generated from the moisture absorbed by the resin of the secondelectrode layer E2 tends to move toward a gap G1. Therefore, the stressfurther tends not to act on the second electrode layer E2. Consequently,the present modification further controls the peel-off of the secondelectrode layer E2.

The configuration where the length L3 is larger than the length L4 hasmore movement paths of the gas than a configuration where the length L3is equal to or smaller than the length L4. In the present modification,the gas generated from the moisture absorbed by the resin of the secondelectrode layer E2 tends to move toward a gap G2. Therefore, the stressfurther tends not to act on the second electrode layer E2. Consequently,the present modification further controls the peel-off of the secondelectrode layer E2.

In the present specification, in a case in which an element is describedas being disposed on another element, the element may be directlydisposed on the other element or be indirectly disposed on the otherelement. In a case in which an element is indirectly disposed on anotherelement, an intervening element is present between the element and theother element. In a case in which an element is directly disposed onanother element, no intervening element is present between the elementand the other element.

In the present specification, in a case in which an element is describedas being positioned on another element, the element may be directlypositioned on the other element or be indirectly positioned on the otherelement. In a case in which an element is indirectly positioned onanother element, an intervening element is present between the elementand the other element. In a case in which an element is directlypositioned on another element, no intervening element is present betweenthe element and the other element.

In the present specification, in a case in which an element is describedas covering another element, the element may directly cover the otherelement or indirectly cover the other element. In a case in which anelement indirectly covers another element, an intervening element ispresent between the element and the other element. In a case in which anelement directly covers another element, no intervening element ispresent between the element and the other element.

Although the embodiment and modification of the present invention havebeen described above, the present invention is not necessarily limitedto the embodiments and modifications, and the embodiment can bevariously changed without departing from the scope of the invention.

The maximum thickness T1 and the maximum thickness T5 may not satisfythe relation of

T5/T1≥0.11.

The maximum thickness T1 and the minimum thickness T6 may not satisfythe relation of

T6/T1≥0.11.

As long as the maximum thickness T1 and the maximum thickness T2 satisfythe relation of

T2/T1≥0.11, and

the maximum thickness T1 and the minimum thickness T3 satisfy therelation of

T3/T1≥0.11,

the multilayer capacitor C1 controls the peel-off of the secondelectrode layer E2.

The maximum thickness T1 and the maximum thickness T5 may not satisfythe relation of

T5/T1≤0.54.

As long as the maximum thickness T1 and the maximum thickness T2 satisfythe relation of

T2/T1≤0.54,

the multilayer capacitor C1 further controls the peel-off of the secondelectrode layer E2.

The maximum thickness T1 and the minimum thickness T6 may not satisfythe relation of

T6/T1≤0.43.

As long as the maximum thickness T1 and the minimum thickness T3 satisfythe relation of

T3/T1≤0.43,

the multilayer capacitor C1 further controls the peel-off of the secondelectrode layer E2.

The maximum thickness T2 of the region E2 ₂ positioned on one of thepair of principal surfaces 3 a and the maximum thickness T1 may satisfythe relation of

T2/T1≥0.11,

and the minimum thickness T3 of the region E2 ₃ positioned on the ridgeportion 3 g between the one of the pair of principal surfaces 3 a andthe end surface 3 e and the maximum thickness T1 may satisfy therelation of

T3/T1≥0.11.

In a case where the maximum thickness T2 of each of the regions E2 ₂ andthe maximum thickness T1 satisfy the relation of

T2/T1≥0.11,

and where the maximum thickness T3 of each of the regions E2 ₃ and theminimum thickness T1 satisfy the relation of

T3/T1≥0.11,

the multilayer capacitor C1 further controls the peel-off of the secondelectrode layer E2.

The maximum thickness T2 of the region E2 ₂ positioned on the one of thepair of principal surfaces 3 a and the maximum thickness T1 may satisfythe relation of

T2/T1≤0.54.

In a case where the maximum thickness T2 of each of the regions E2 ₂ andthe maximum thickness T1 satisfy the relation of

T2/T1≤0.54,

the multilayer capacitor C1 further controls the peel-off of the secondelectrode layer E2.

The minimum thickness T3 of the region E2 ₃ positioned on the ridgeportion 3 g between the one of the pair of principal surfaces 3 a andthe end surface 3 e and the maximum thickness T1 may satisfy therelation of

T3/T1≤0.43.

In a case where the minimum thickness T3 of each of the regions E2 ₃ andthe maximum thickness T1 satisfy the relation of

T3/T1≤0.43,

the multilayer capacitor C1 further controls the peel-off of the secondelectrode layer E2.

In a cross-section orthogonal to the principal surface 3 a and the endsurface 3 e, the surface of the region E2 ₂ may not curve in a convexshape in a direction away from the principal surface 3 a. In a casewhere, in the cross-section orthogonal to the principal surface 3 a andthe end surface 3 e, the surface of the region E2 ₂ curves in a convexshape in the direction away from the principal surface 3 a, themultilayer capacitor C1 controls the peel-off of the second electrodelayer E2 more reliably as described above.

In a cross-section orthogonal to the side surface 3 c and the endsurface 3 e, the surface of the region E2 ₄ may not curve in a convexshape in a direction away from the principal surface 3 a. In a casewhere, in the cross-section orthogonal to the side surface 3 c and theend surface 3 e, the surface of the region E2 ₄ curves in a convex shapein the direction away from the principal surface 3 a, the multilayercapacitor C1 controls the peel-off of the second electrode layer E2 morereliably as described above.

When viewed from the first direction D1, the end edge of the region E2 ₂may not curve. In a case where, when viewed from the first direction D1,the end edge of the region E2 ₂ curves, the stress further tends not toact on the second electrode layer E2 as described above.

When viewed from the second direction D2, the end edge of the region E2₄ may not curve. In a case where, when viewed from the second directionD2, the end edge of the region E2 ₄ curves, the stress further tends notto act on the second electrode layer E2 as described above.

The electronic components of the present embodiment and modification arethe multilayer capacitors. Applicable electronic component is notlimited to the multilayer capacitor. Examples of the applicableelectronic components include, but not limited to, multilayer electroniccomponents such as a multilayer inductor, a multilayer varistor, amultilayer piezoelectric actuator, a multilayer thermistor, or amultilayer composite component, and electronic components other than themultilayer electronic components.

What is claimed is:
 1. An electronic component comprising: an elementbody including a side surface and an end surface, the side surface andthe end surface being adjacent to each other; and an external electrodedisposed on the side surface and the end surface, wherein the externalelectrode includes a conductive resin layer disposed over the sidesurface and the end surface, and includes a plating layer covering theconductive resin layer, the conductive resin layer includes a firstregion positioned on the end surface, a second region positioned on theside surface, and a third region positioned on a ridge portion betweenthe end surface and the side surface, and in a case where a maximumthickness of the first region is T1 (μm), a maximum thickness of thesecond region is T2 (μm), and a minimum thickness of the third region isT3 (μm), the maximum thickness T1 and the maximum thickness T2 satisfy arelation ofT2/T1≥0.11, and the maximum thickness T1 and the minimum thickness T3satisfy a relation ofT3/T1≥0.11.
 2. The electronic component according to claim 1, whereinthe maximum thickness T1 and the maximum thickness T2 satisfy a relationofT2/T1≥0.13.
 3. The electronic component according to claim 1, whereinthe maximum thickness T1 and the minimum thickness T3 satisfy a relationofT3/T1≥0.12.
 4. The electronic component according to claim 1, whereinthe maximum thickness T1 and the maximum thickness T2 satisfy a relationofT2/T1≤0.54.
 5. The electronic component according to claim 1, whereinthe maximum thickness T1 and the minimum thickness T3 satisfy a relationofT3/T1≤0.43.
 6. The electronic component according to claim 1, furthercomprising a circuit element disposed in the element body, wherein theelement body includes a first portion where the circuit element isdisposed and a second portion where the circuit element is not disposed,and in a case where a thickness of the first region at a positioncorresponding to a boundary between the first portion and the secondportion is T4 (μm), the maximum thickness T1 and the thickness T4satisfy a relation ofT4/T1≥0.11.
 7. The electronic component according to claim 6, whereinthe maximum thickness T1 and the thickness T4 satisfy a relation ofT4/T1≥0.26.
 8. The electronic component according to claim 6, whereinthe maximum thickness T1 and the thickness T4 satisfy a relation ofT4/T1≤0.55.
 9. The electronic component according to claim 6, whereinthe maximum thickness T2, the minimum thickness T3, and the thickness T4satisfy a relation ofT4>T2 and a relation ofT4>T3.
 10. The electronic component according to claim 1, wherein, in across-section orthogonal to the side surface and the end surface, asurface of the second region curves in a convex shape in a directionaway from the side surface.
 11. The electronic component according toclaim 1, wherein the external electrode further includes a sinteredmetal layer, the sintered metal layer being disposed over the sidesurface and the end surface and being covered with the conductive resinlayer, and with a plane including the end surface as a reference plane,a length from an end edge of the sintered metal layer to an end edge ofthe second region in a direction orthogonal to the end surface is largerthan a length from the reference plane to the end edge of the sinteredmetal layer in the direction orthogonal to the end surface.
 12. Theelectronic component according to claim 1, wherein, when viewed from adirection orthogonal to the side surface, an end edge of the secondregion curves.